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Stockholm-based deep-tech startup TeraSi announced that it has secured 13M SEK (€1M) in a pre-seed funding round to advance its proprietary system-in-package technology.
The funding comes from Navigare Ventures, Almi Invest, Onsight Ventures, Deeptech Labs, and existing investors.
The company’s technology addresses the challenges of packaging high-frequency chips for wireless applications above 60 GHz, including the upcoming 6G communication network.
With the additional funding, TeraSi says it can also invest in manufacturing infrastructure and implement an aggressive IP strategy. It will enable the company to launch new products tailored for the test and measurement, radar and wireless markets.